STMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand

• PIC100 technology in 300 mm high-volume production for leading hyperscalers, with plans to quadruple capacity by 2027 and further expand in 2028
• ST unveils PIC100 through-silicon via (TSV) upcoming technology roadmap

, a global semiconductor leader serving customers across the spectrum of electronics applications, is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and AI clusters. The 800G and 1.6T PIC100 transceivers enable higher bandwidth, lower latency, and greater energy efficiency as AI workloads surge.

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AI infrastructure is experiencing unprecedented scaling, with cloud-optical interconnect performance becoming a critical bottleneck. Drawing on years of silicon photonics innovation, ST’s PIC100 platform provides state-of-the-art optical performance, including best-in-class silicon and silicon nitride waveguide losses (respectively as low as 0.4 and 0.5 dB/cm), advanced modulator and photodiode performance, as well as an innovative edge coupling technology.

In parallel with high-volume PIC100 production, ST is planning to introduce the next step in its silicon photonics technology roadmap: the PIC100 TSV, a new and unique platform that integrates through-silicon via (TSV) technology to further increase optical connectivity density, module integration, and system-level thermal efficiency. The PIC100 TSV platform is designed to support future generations of Near Packaged Optics (NPO) and co-packaged optics (CPO), aligning with hyperscalers’ long-term migration paths toward deeper optical–electronic integration for scale up.

ST will discuss business and technology roadmap updates at the upcoming Optical Fiber Communication Conference® (March 15-19

), Los Angeles, USA:

• paper titled
  “An Innovative 300mm Back Side Integrated Silicon Photonics Platform for 200Gbits/lane Applications”
• First PIC100-based demo of a 1.6T-DR8 silicon photonics transceiver, engine by Sicoya and STMicroelectronics. See it on the Sicoya booth #507
• Participation to the CEA-Leti event:
  “Optical Interconnects: Driving Innovation in AI Factory and Beyond” (March 18, 6-8pm PT)
  
  
  

At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027.

Further information can be found at

  

INVESTOR RELATIONS

Jérôme Ramel
EVP Corporate Development & Integrated External Communication
Tel: +41.22.929.59.20
    

MEDIA RELATIONS

Alexis Breton
Group VP Corporate External Communications
Tel: +33.6.59.16.79.08

  

Attachments

• Cloud AI server room
• T4761S -- Mar 9 2026 -- PIC100 volume production_FINAL FOR PUBLICATION_FLS UPDATED