Intel achieves progress in ultra-large packaging technology

Glonghui, July 30｜According to Sci-Tech Innovation Board Daily, Intel has made progress in its ultra-large package technology, enabling it to manufacture ultra-large chips more than 12 times the size of a photomask. At Intel's factory in Rio Rancho, New Mexico, its advanced packaging technology is pushing the "mask limit"— expanding package sizes to 8 times the current industry standard, and exceeding 12 times by 2028. These ultra-large chip packages measure 240 mm x 240 mm, with mask sizes reaching 24 times, making them larger than any current packaging except for panel-level packaging. As Intel continues to accelerate the promotion of its advanced packaging solutions, the company will keep advancing package sizes beyond 7 times the mask size; in the near-term roadmap, package sizes will expand to more than 12 times the mask size, while panel-level packaging will enable sizes greater than 50 times the mask size.